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MRC | Criteria | Characteristic |
---|---|---|
CTQX | Current Rating Per Characteristic | 250.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CSSL | Design Function And Quantity | 1 PROCESSOR, INPUT/OUTPUT |
CQSJ | Inclosure Material | CERAMIC |
CBBL | Features Provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ELECTROSTATIC SENSITIVE AND POSITIVE OUTPUTS |
CWSG | Terminal Surface Treatment | SOLDER |
ADAT | Body Width | 1.560 INCHES MINIMUM AND 1.590 INCHES MAXIMUM |
ADAQ | Body Length | 1.560 INCHES MINIMUM AND 1.590 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.5 WATTS |
ADAU | Body Height | 0.070 INCHES MINIMUM AND 0.090 INCHES MAXIMUM |
CXCY | Part Name Assigned By Controlling Agency | GRAPHICS PROCESSOR |
MRC | Decoded Requirement | Clear Text Reply |
TTQY | Terminal Type And Quantity | 132 FLAT LEADS |
CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CZEP | Capitance Rating Per Characteristic | 20.00 INPUT PICOFARADS MAXIMUM AND 20.00 OUTPUT PICOFARADS MAXIMUM |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | Time Rating Per Chacteristic | 50.00 NANOSECONDS MAXIMUM DELAY |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
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