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MRC | Criteria | Characteristic |
---|---|---|
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | Input Circuit Pattern | 36 INPUT |
CQSJ | Inclosure Material | CERAMIC |
CSSL | Design Function And Quantity | 1 MICROPROCESSOR |
CWSG | Terminal Surface Treatment | SOLDER |
CBBL | Features Provided | HIGH SPEED AND CASCADABLE AND W/CLOCK AND BIPOLAR |
ADAT | Body Width | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM |
CQSZ | Inclosure Configuration | QUAD-IN-LINE |
ADAQ | Body Length | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 150.0 MILLIWATTS |
ADAU | Body Height | 0.055 INCHES MAXIMUM |
MRC | Decoded Requirement | Clear Text Reply |
TTQY | Terminal Type And Quantity | 68 PIN |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CZEN | Voltage Rating And Type Per Characteristic | 5.0 VOLTS MAXIMUM POWER SOURCE |
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