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MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 45.00 NANOSECONDS NOMINAL ACCESS |
CXCY | Part Name Assigned By Controlling Agency | 128K X 8 LOW POWER CMOS SPRAM DUAL CE |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
CZER | Memory Device Type | RAM |
MRC | Decoded Requirement | Clear Text Reply |
CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND MONOLITHIC |
CQSZ | Inclosure Configuration | FLAT PACK |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | Terminal Type And Quantity | 32 FLAT LEADS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
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