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MRC | Criteria | Characteristic |
---|---|---|
CZER | Memory Device Type | PAL |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
CQSJ | Inclosure Material | CERAMIC |
CWSG | Terminal Surface Treatment | SOLDER |
CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
TTQY | Terminal Type And Quantity | 44 J-HOOK |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
MRC | Decoded Requirement | Clear Text Reply |
NHCF | Nuclear Hardness Critical Feature | HARDENED |
CZEQ | Time Rating Per Chacteristic | 60.00 NANOSECONDS MAXIMUM DELAY |
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